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3. Mechanical abrasion of the adhesive surfaces for better adhesion of plating resist 4. Application of plating resists (screening ink or dry film resist) 5. Formation of microporous structure of exposed adhesive surfaces by chemical etching in acid solution (CrO3/H2SO4 or CrO3/HBF) 6. Fully electroless copper deposition on the conductor tracks and hole walls 7. Panel baking 8. Application of solder mask and legends 9. Final fabrication and test 31.3.1.2 Resist Issues. When the conductor width is 8 mil (0.2 mm) or wider, image transfer (step 4) for a majority of CC-4 boards is still done by screen printing with thermally curable or UV-curable ink, since the cost of imaging by screening method is less than one-third that of dry film imaging. The plating resist is permanent; that is, it stays permanently as an integral part of the board. UV-curable ink is preferred because of its shorter curing time that tends to minimize lateral ink flow while being cured. Lateral ink flow narrows the conductor width since the conductor is formed in the trench between plating resists. See Fig. 31.3. uwp barcode generator Generate Barcode and QR code in Windows Universal app ...
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Shows how to obtain a barcode scanner , claim it for exclusive use, enable it to ... the samples collection, and GitHub, see Get the UWP samples from GitHub. 31.3.1.3 Typical Plating Conditions. Although the practical limitation of screen printing conductor pattern is 8 mil (0.2 mm), in a mass production environment, 6-mil (0.15 mm) conductor patterns have been successfully screened, but such a pattern is confined to a limited area of the panel. Therefore, a conductor pattern which is less than 6 to 7 mil is normally formed by dry film resist. E.I. du Pont de Nemours & Co. and Hitachi Chemical Co., Ltd., are two major suppliers of permanent dry film plating resists which withstand the hostile plating bath environment.Typically, additive bath temperatures range from 68 to 80 C and pH from 11.8 to 12.3, and panels must stay in the bath for more than 10 h with plating speed of typically 2.0 to 2.5 mm/h. Since the use of solvent such as 1-1 trichloroethane is being banned, semiaqueousdevelopable permanent dry film resist has been developed by Hitachi Chemical to withstand the plating condition as previously described and is used extensively in Japan. Since paper-based laminates are still the dominant materials in Japan (although CEM-3 and FR-4 laminates have been used increasingly in recent years), some allowance for this material in the plating solution is made. Therefore, plating baths for paper-based laminates are usually maintained at the lower end of the operating temperature (68 to 72 C) in order not to delaminate them. 31.3.1.4 Permanent Plating Resist. The use of a permanent plating resist creates a flush surface, where the copper and resist are at the same height from the base laminate. This offers two distinct benefits. In the board fabrication process, after the conductors are formed, the uwp generate barcode UWP UI Controls | 40+ UWP Grids, Charts, Reports | ComponentOne
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Add barcode images to grid cells, .NET PrintDocument objects, or generate them from a Web service. With support for virtually any 2D and linear barcode ... FIGURE 31.4 Flush surface resulting from additive plating with permanent plating resist. (Photo courtesy of Ibiden Co. Ltd.) chance of their destruction due to scratch is minimized. (See Fig. 31.4.) In addition, the flush surface makes the application of solder mask easier and reduces the consumption of solder resist by as much as 30 percent when compared to that incurred in a conventional subtractive, etched foil process. In the board assembly process, a permanent plating resist acts as the solder resist and tends to minimize solder bridges during the soldering operation, particularly for fine-pitch devices. Since the interrupt can occur at any time, the processor status (flags, etc) must be saved so that normal program execution can resume after the ISR is completed The processor status is contained in the SREG register The ISR must save the SREG before executing any other instruction, and before returning control to the main program, must restore the SREG register This can be done in two ways: either the SREG is copied into another register, say R1, which must not be used for any other purpose, and before the ISR executes the RETI instruction, R1 is copied back into SREG Another way to save the SREG is to save it on the stack (using the PUSH SREG instruction) and then before executing the RETI instruction, the SREG value is copied back from the stack (using the POP SREG instruction). Noncatalytic Laminate with AP-II22 AP-II is an abbreviation of Additive Process II developed by Hitachi Ltd. This process also makes use of permanent plating resist. However, unlike the CC-4 process, it starts with noncatalytic laminate coated with noncatalytic adhesive. Its process sequence is as follows. 31.3.2.1 Process Steps Fig 610: The CSO Deep Blue from Technip-Coflexip is equipped with the heaviest bearings and bearing housings 1. Noncatalytic laminate coated with noncatalytic adhesive 2. Hole formation 3. Mechanical abrasion of adhesive surfaces followed by chemical roughening (adhesion promotion) 4. Catalyzation of the surfaces and hole walls 5. Application of plating resists The rest of the process is essentially the same as the CC-4 process (steps 6 through 9). 31.3.2.2 Advantages/Disadvantages. This catalyzing version of the pattern-plating additive process has one advantage over the CC-4 process, that is, the use of noncatalytic base laminates which are cheaper than catalyzed laminates. On the other hand, this process has a disadvantage also in that pattern repair before plating is not possible because resist which uwp barcode generator Windows Barcode Generator - Abacus Health Products
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