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be simplified with the aid of Table 62 in which desired function is matched with the type of bearing A number of parameters may influence the choice of the bearing and also design considerations that directly affect the performance of the machine These parameters which include speed and acceleration limits, range of motion, applied loads, accuracy, repeatability, resolution, preload, stiffness, vibration and shock resistance, damping capability, friction, thermal performance, environment sensitivity, sealability, size and configuration, weight, support equipment, maintenance, material compatibility, mounting requirements, required life, availability, designability, manufacturability and lastly cost are mostly similar for sliding contact bearings [9]

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RDLC reports, created by the Visual Studio ReportViewer control based on Report Definition Language Client Side, are local reports and completely run in local ...

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Maintaining uniform thickness on the panel surface in a galvanic plating operation is difficult. As the aspect ratio becomes higher, maintaining uniform thickness on the hole wall is also a problem. Electroless plating offers two distinctively superior features in this respect: 1. Its excellent throwing power for high-aspect-ratio holes (Fig. 31.5) 2. Its ability to deposit copper film of even thickness over the entire circuit panel. These features of fully electroless plating are ideal for the fabrication of high-tech MLBs, as described in Table 31.1. All signal conductors of the MLBs are formed on innerlayers and the outerlayer surfaces provide pads only for through holes and some bonding pads for decoupling capacitors. The process steps of the panel-plate additive method are essentially the same as those of the galvanic panel-plate method:

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FIGURE 31.5 Excellent hole coverage is achieved by fully additive plating. This shows the cross section of a hole with a 27:1 aspect ratio. (Photo courtesy of Hitachi Ltd.)

If another interrupt occurs during the time when an ISR is already operating, then it will be serviced by interrupting the original ISR The priority of interrupts is determined by the way the interrupt vectors are assigned An interrupt vector at a lower address in the program memory has a higher priority The priority of interrupt is used to decide which interrupt gets serviced first if more than one interrupt is pending at any moment of time This situation can arise when global interrupts have been disabled in a system to allow some critical section of the program to execute After the critical section is completed, the program enables the global interrupts Now, during the time the critical section was being executed, two interrupts, an external Interrupt0 and UART Rx Complete interrupt occurred.

3. Catalyze holes. 4. Perform fully electroless copper deposition (panel-plate). 5. Perform dry film tent-and-etch.

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Process Issues Tenting with dry film becomes difficult when annular rings are very small or in some cases when there are no annular rings at all. In such cases, a positive electrodeposition system may be applied to overcome this difficulty. It should be cautioned, however, that there is a limitation to this panel-plate additive approach, even though the thickness of deposited copper film is much more even across the panel. If very fine conductors are to be formed by this method, the conductor cross section becomes intolerably distorted from the ideal rectangular shape as the ratio of the width to the height of the conductor approaches unity, as shown in Fig. 31.6.

The fitting of the bearing to the shaft requires the utmost care to ensure the satisfactory working of the machine The tolerance of Fig 611: Roller bearings with the shaft and the bearing is particularly crucial especially for the ceramic rollers [11] bore of the bearing and the outer diameter of the shaft Different tolerance levels are required under various conditions to obtain the proper fits for a certain application [6] Figure 612 indicates the range of the tolerance of the shaft and the housing with respect to bearing tolerances Table 63 and Table 64 show the deviation in diameter for the basic hole and basic shaft system, respectively

FIGURE 31.6 Formation of fineline conductors by etching process results in undesirable, nonrectangular conductor cross section. (Photo courtesy of Ibiden Co., Ltd.)

As in the case of the panel-plate additive method, the partly additive process starts with copper-clad laminate.11 14 The essence of this process is to minimize the problem encountered in etching fineline conductors through thick copper which results from through-hole plating (in the conventional etched foil process, through-hole is plated first), by forming conductors first, prior to through-hole plating.

Process Steps 1. 2. 3. 4. 5. 6. 7. Copper-clad laminate. Perform hole formation. Catalyze hole walls and remove catalyst sites from the surfaces by brushing. Perform image transfer by screen print or dry film tenting. Form conductor pattern by etching and stripping the resist. Apply plating resist over the entire surface, but leaving pads and holes uncovered. Perform electroless copper deposition onto the pads and hole walls.

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